Explore BrainMass
Share

Heat Conduction for Temperature Distribution and Heat Flux

This content was STOLEN from BrainMass.com - View the original, and get the already-completed solution here!

An artificial satellite in space has a panel attached to it with dimensions 20m X 25m X 3m. The panel is made of Carbon steel with a carbon content of 1.5%. In the temperature range of interest, the value of the thermal conductivity is k = 36 W/(m-°C). The panel has an artificial heating source applied to it causing it to have a constant energy generation = 4 W/m3. One side of the panel is measured as 3° C (x=0) and the other side of the panel is at 17.5° C (x=3m).

1. Write the heat conduction equation for this case.
2. Using the boundary conditions, find the integration constants (C1 and C2).
3. What is the temperature distribution across the width of the satellite panel?
4. What is the temperature in the center of the width of the panel?
5. What is the heat flux anywhere in the panel?
6. What is the value of the heat flux on each side of the panel (at x=0 and at x=3)?

© BrainMass Inc. brainmass.com October 25, 2018, 9:34 am ad1c9bdddf
https://brainmass.com/physics/conduction/heat-conduction-temperature-distribution-heat-flux-578795

Attachments

Solution Preview

http://www.space.com/missionlaunches/sts112_update_021014.html
Panel released in space by NASA

www-d0.fnal.gov/~diehl/Public/snap/meetings/diehl_cm_mar-29-2003.ppt
Satellite with panel design

An artificial satellite in space has a panel attached to it with dimensions 20m X 25m X 3m. The panel is made of Carbon steel with a carbon content of 1.5%. In the temperature range of interest, the value of the thermal conductivity is k = 36 ...

Solution Summary

The steps for solving this heat conduction of a satellite panel are described, related equations given, and solutions provided. Details are given that can be used to solve related heat conduction equation problems. This solution contains a document in pdf and word format.

$2.19
See Also This Related BrainMass Solution

Heat transfer Using Reynolds Analogy

A circuit board with a dense distribution of integrated circuits (ICs) and the
dimensions of 120mm by 120mm on a side is cooled by a parallel flow of atmospheric air with a velocity of 2 m/s.

From wind tunnel tests under the same flow conditions , the average frictional shear stress on the upper surface is determined to be 0.0625N/m^2. What is the allowable power dissipation from the upper surface of the board if the average surface temperature of the ICs must not exceed the ambient air by more than 25 degrees C ?

Answer given is---14.3 W

View Full Posting Details