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Catalyst to Reduce Cure Temperature in Bonding Wood with MDI

I have a wood chemistry course that indicates that methylene diphenylisocyanate (MDI) is used as a common resin and/or glue in bonding wood fibers together in composite type substrates. The cure temperature is given as approximately 425 degrees F.

I have a test question that asks us to hypothesize about a chemical additive to the MDI resin/glue that might either speed its cure time reaction or cause the cure to be at a lower temperature....say 375 degrees F.

Solution Summary

The solution shows examples of additives that accelerate bonding of wood with MDI.